3, Potassium Monopersulfate   Electronic Grade

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3.1 microetchant ADZ100 Brand ,PCB microetching  

3.1. microetchant ADZ100 Brand ,PCB microetching

3.1.1 Main ingredients: composite peroxides and organic acids,

3.1.2 Auxiliary ingredients: synergists and stabilizers.

3.1.3 Application: PCB microetching, Semiconductor manufacturing process

3.1.4  Applicable manufacturing process:

3.1.4.1. dry film pretreatment,inner and outer (HDI fine- line application)

3.1.4.2. PTH micro etching pretreatment

3.1.4.3, Cu Ⅰ, Cu Ⅱ micro etching pretreatment

3.1.5 Chemical properties: stable at room temperature, The active substances of ANSIN DZ100 are the active oxygen (AO) by peroxymonosulfuric acid, with a very strong and effective non-chlorine oxidation, even chlorine ion oxidized to chlorine, and meeting the requirements of safety and environment during the process of treatment, widely used in industry and daily chemistry.

3.2 microetchant ADZ200 Brand, PCB microetching  

3.2.Microetchant ANSIN DZ200 Brand

3.2.1 Application: PCB microetching, Semiconductor manufacturing process

3.2.2 Applicable manufacturing process

3.2.2.1. OSP pre-processing

3.2.2.2. Pretreatment of chemical gold and electroplating gold

3.2.2.3. Tin and silver pretreatment

3.2.2.4. Soft plate pretreatment

3.2.3 Physical properties: white powdery solid, soluble in water.

3.3 microetchant DZA25P, AN515 Brand, microetching treatment

3.3 microetchant DZA25P, AN515 Brand

The micro etchant is formulated by DZA25P and DZA200, used for the microetching treatment of copper surface in the production of printed circuit board, making coppercoating thinner evenly, cleaning  the coarsened surface of copper,suitable for microetching process before drying film or OSP

3.3.1 Characteristics:

3.3.1.1 stable etching speed, clear solution, easy to maintain, and without organic solvent, meeting the environmental requirements;

3.3.1.2  Suitable for pretreatment of OSP plate before micro etching, avoiding the copper plate over etching and disconnected;

3.3.1.3 making the surface of copper plate less coarsened after micro etching, with higher solderability of OSP plate, and no color phenomenon on the surface of OSP film.

3.3.2 Usage:

Note: All information is given in good faith, but without warranty,and  verification by the user is recommended.